plaats van herkomst
Guangdong, China
modelnummer
Thermal pad T-1
toepassing
High Temperature
products name
laptop heatsink pad
Filler Material
Ceramic filler
Elastomer Type
silicon rubber
Application
Communication equipment,Memory module,Heat pipe assembly,etc.
Size
200*300*4.0mm,customize
operating temperature
-50-200℃
Style
New SMD DIP IC GPU BGA Chip Silicone Conduction Heatsink Thermal Pad
Thermal Conductivity
1-5W/m.K,≥6W/m.K
color
Wathet,light purple,Pink,Gray,Customizable