plaats van herkomst
Guangdong, China
belangrijkste grondstof
Epoxy
gebruik
Bouw, Fiber & Garment, Footwear & Leather, Verpakking, Transport, metal
andere namen
Chip bottom filling epoxy potting compound
classificatie
Other Adhesives
naam van het merk
DeepMaterial
type
Chip bottom filling epoxy potting compound
Product name
Chip bottom filling epoxy potting compound for electronics
Curing method
Moisture cure
Product Description
Rapid factorization, cE high TG, liquidity
Application scenario
Chip bottom filling
Curing conditions
10min @ 130℃